Epoxy Resin Potting & Encapsulation Compounds

Epoxy Resin Potting & Encapsulating Features & Specifications

AeroMarine Products Epoxy #300/11 is a high-performance epoxy used primarily for potting and encapsulating electronic circuits. It is available either in black or clear amber. The black version is extremely popular for hiding proprietary circuitry. It is also used as a coating to provide a dielectric barrier.

Features:

• Long work life
• Room temperature cure
• Low viscosity
• Simple, noncritical 1-1 mix ratio

**IF USING THE BLACK VERSION, YOU MUST TURN THE CONTAINER UPSIDE DOWN EVERY 7 DAYS TO MAINTAIN COLOR DISPERSION. SHAKE THE BLACK RESIN VIGOROUSLY FOR 2 MINUTES BEFORE USING!**

Specifications:

• Viscosity: 3000cps maximum
• Color: Clear Amber or Black
• Work life: 45-60 minutes@70F
• Cure time: 24 hours@70F
• Thermal Conductivity: 4.2 BTU/hr/ft2/ºF/in.
• Shear strength: 2500psi
• Tensile Strength 8000 psi
• Flexural strength: 12,800psi
• Dielectric Constant 3.5 @ 1 KHz @ 23°C (73°F)
• Volume Resistivity 4.1 x 1014 ohm-cm
• Modulus of elasticity: 5.7 x 106
• Dielectric Strength: 450 volts per mil (.001”)